Optimizing X2Y Performance with Proper Attachment Techniques

Our X2Y® low inductance capacitors deliver excellent performance in EMI/RFI filtering and power delivery bypass / decoupling appications. Physical electrical placement on the PCB is critical in achieving best results.

In EMI Filter application stray inductance should be minimized between signals and the A and B capacitor pads. Use star or daisy chain routes, rather than "T" to capacitor pads as show in Figure 1.

For PDN bypass applications Figure 2 compares the X2Y® recommended layout against a poor layout. Because of its long extents from device terminals to vias, and the wide via separation, the poor layout exhibits approximately 200% L1 inductance, and 150% L2 inductance compared to the recommended X2Y layouts.

As with any ceramic capacitor, hand soldering is discouraged due to the rick of thermal crack failure. If hand soldering is employed for lab evaluation, pre-heat the assembly and utilize contact-less soldering methods such as a hot air tool.

For further details on via placement and it’s effect on mounted inductance, please refer to X2Y Attenuators, LLC. application note “Get the Most from X2Y Capacitors with Proper Attachment Techniques”